DEVICE AND METHOD FOR SOLDERING,申请号JP19930106184-传众专利搜索

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发明名称	DEVICE AND METHOD FOR SOLDERING
摘要
申请公布号	JPH06296077(A)	申请公布日期	1994.10.21
申请号	JP19930106184	申请日期	1993.04.08
申请人	SONY CORP	发明人	HASEGAWA KIYOSHI;OZAKI YUJI
分类号	H01L21/52;H01L21/60;H05K3/24;H05K3/34;(IPC1-7):H05K3/34	主分类号	H01L21/52
代理机构		代理人
主权项
地址

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