发明名称 HEAT-INSULATING MULTILAYER SYSTEM
摘要 <p>The thermal insulation compound system (3) for fastening to a building wall (1) comprises a light-absorbing wall outer face (2), an at least partially light-transmitting thermal insulation material (4) and, on the outside, a weather-resistant, at least partially light-transmitting plaster layer (5), if desired with interposition of a light-transmitting reinforcement (6). This plaster layer (5), with a layer thickness of between 0.5 and 6 mm, consists of a hardening binder containing filler to an extent that the degree of radiation transmission in the case of perpendicular irradiation lies above 20 %. To avoid overheating, at least one layer having a multiplicity of embedded hollow bodies or microhollow bodies is applied to the thermal insulation material, said hollow bodies or microhollow bodies forming a transparent spatial limitation for a material whose light-transmitting capacity reversibly decreases when a predetermined temperature is exceeded. <IMAGE></p>
申请公布号 CZ9400573(A3) 申请公布日期 1994.10.19
申请号 CZ19940000573 申请日期 1994.03.14
申请人 STO AKTIENGESELLSCHAFT 发明人 GROCHAL PETER DR.
分类号 E04B1/74;E04F13/02;E04F13/14;F24J2/04;F24J2/40;F24J2/51;(IPC1-7):E04F13/02 主分类号 E04B1/74
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