| 摘要 |
<p>PURPOSE:To make it possible to mass-produce a product excellent in various characteristics by a method wherein a plurality of recessed parts, the number of which is equal to the number of facets in multifacetting, are formed on at least one multifacetting resin plate and, after non-contact IC modules are installed in recessed parts both the resin plates are bonded together into an integral body. CONSTITUTION:In order to manufacture the non-contact IC card concerned, firstly a plurality of recessed parts, the number of which is equal to the number of facets in multifacetting, are formed on at least one resin plate 2 out of a pair of or front and rear multifacetting resin plates 1 and 2. Next, non-contact IC modules 3 are installed in the recessed parts 4. In succession, by applying adhesive on the one resin plate 2 and piling both the resin plates 1 and 2 at their mating surfaces 7 and pressing, both the resin plates 1 and 2 and the non-contact IC modules 3 are bonded together into an integral body. After that, the resultant body is punched in card-sized pieces. Thus, the non-contact IC card, which is equipped with enough mechanical strength and airtightness, excellent in reliability and manageability and, at the same time, has fine outer appearance, can be mass-produced at high quality.</p> |
