| 摘要 |
PURPOSE:To improve the bonding strength of an aluminum wire by a method wherein the thickness of a nickel plating layer provided as a layer for improving the close contact of copper with gold is made to be in a specified range. CONSTITUTION:On a base film 103 constituted of polyimide, a conductor layer 105 of a copper leaf, a nickel plating layer 106 and a gold plating layer 107 are laminated in prescribed layer thicknesses respectively by plating with a bonding layer 104 of epoxy resin interlaid, whereby a flexible wiring board 1 is constructed. The thickness of nickel plating of the nickel plating layer 106 is made to be 10 to 20mum. Thereby a strength on the base film 103 is improved and, accordingly, a bonding strength of an aluminum wire 3 for wire bonding is improved. |
