METHOD FOR BONDING A POROUS MEDIUM TO A SUBSTRATE

摘要

A method for bonding a porous medium to the surface of a solid substrate is disclosed. The method comprises positioning a dry porous medium near a dry surface of a substrate and impregnating the porous medium with a bonding composition by opening a valve and allowing the bonding composition to pass through passageway to groove. The impregnated porous medium is maintained near the substrate surface until the substrate surface is at least slightly dissolved in the bonding composition without dissolving the porous medium. At least a portion of the bonding composition is flushed through the impregnated porous medium towards the substrate and subsequently away from the surface of the substrate by opening of valve at the adaptor to a vacuum source. The bonding composition is then evaporated at a controlled rate from the substrate and the porous medium.