发明名称 MULTILAYER CONNECTION METHOD OF FLEXIBLE CIRCUIT BOARD
摘要 PURPOSE:To enable laminated flexible circuit boards to be surely, electrically connected together without using a jointing means such as an eyelet pin or the like preventing the conductors from deteriorating in contact force with time by a method wherein the laminated flexible circuit boards are pressed by a recessed die provided with an inclined groove wall and a protrudent die provided with a slope which confronts the inclined groove wall of the recessed die. CONSTITUTION:Flexible circuit boards 2 are connected together through such a multilayer connecting method that, the circuit boards 2 are made to overlap each other making the exposed conductors of the circuit boards confront each other and connected together. The flexible printed boards 2 are compressed between a recessed die 5 provided with an inclined groove wall 9 and a protrudent die 7 provided with a slope 10 which confronts the inclined groove wall 9 in the above connecting method to join the opposed exposed conductors 3 together between the inclined groove wall 9 and the slope 10 through shear friction. For instance, the flexible printed circuit boards 2 each provided with a turnup end 1 are made to overlap each other making the exposed circuit conductors 3 of the turnup ends 1 confront each other. The overlapped ends 1 are pressed by the metal recessed die 5 and a protrudent die 7 with a high pressure.
申请公布号 JPH06260755(A) 申请公布日期 1994.09.16
申请号 JP19930046601 申请日期 1993.03.08
申请人 YAZAKI CORP 发明人 KURITA KAORU
分类号 H05K1/00;H05K3/36;H05K3/40;H05K3/46 主分类号 H05K1/00
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