发明名称 |
Method of manufacturing insulation substrate for semiconductor device and metal pattern plate used therefor |
摘要 |
In manufacturing an insulation substrate used in a semiconductor device, a metal plate (10) having relatively thick body portions (11a,11b,11c) and relatively thin linkage portions (12,13) is prepared. The body portions are spaced from each other and the linkage portions link up the respective body portions. The metal plate is fixed to a metal flat plate (1) through a resin layer (2). The linkage portions are then removed through selective etching. The structure thus obtained is cut into a plurality of unit structures, to thereby obtain an in insulation substrate having conductive circuit patterns thereon. |
申请公布号 |
US5336364(A) |
申请公布日期 |
1994.08.09 |
申请号 |
US19930118260 |
申请日期 |
1993.09.09 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
TAKAHAMA, SHINOBU;KAMISHIMA, KUNITAKA |
分类号 |
H05K3/44;H01L21/48;H01L23/12;H01L23/14;H01L23/48;H01L23/495;H05K3/02;(IPC1-7):B44C1/22;C23F1/00 |
主分类号 |
H05K3/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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