发明名称 LASER ETCHING METHOD AND DEVICE THEREFOR
摘要 PURPOSE: To enable an etching pattern to be formed more sharply and correctly in the laser etching of a circular template. CONSTITUTION: A lacquer layer formed on a hollow cylinder 8 is eroded within specified pattern regions by a laser beam 4. The erosion of the lacquer layer within the pattern regions occurs due to the continuous emission of the laser beam 4. In this case, the laser beam 4 is deenergized at the end of every pattern region within a time interval of 12 μs to 30 μs. Radiation returning to the laser beam path after being reflected back by a metal screen 8 is removed from the laser beam path. Thus the deenergization of the laser beam 4 occurs in a short time resulting in the generation of patterns with sharp edge structures.
申请公布号 JPH06206295(A) 申请公布日期 1994.07.26
申请号 JP19930241844 申请日期 1993.09.28
申请人 SHIYABUROONEN TECHNIC KUFUSUTAIN GMBH 发明人 YAKOBU AKIRAINERU
分类号 B23K26/00;B23K26/08;B23K26/42;B41C1/05;B41C1/14;C23F4/04 主分类号 B23K26/00
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