| 摘要 |
The semiconductor chip module comprises a substrate (1) on which a wiring portion is formed, a semiconductor chip (6) mounted so as to face a circuit side down to the wiring portion, a heat sink (3) with one end in contact with a side opposite to the circuit side of the semiconductor chip (6), and a cap (4) enclosing the semiconductor chip and having an opening (4a) exposing externally the other end of the heat sink (3). A metal film (m) is formed at least on the inner wall of the opening (4a) and on the surface of the heat sink (3) which is inserted into the cap (4). An adhesive material (s) is filled between the tip portion of the heat sink (3) and the semiconductor chip (6), as well as in the gap between the inner wall of the opening of said cap (4) and said heat sink (3). |
