PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT

摘要

PURPOSE:To provide a package for housing semiconductor element capable of effectively averting the thermal effect and power supply noise effect upon a semiconductor element thereby enabling the semiconductor element to be actuated normally and stably for a long time. CONSTITUTION:Within the package for housing semiconductor element wherein a connecting pad 5a connected to power supply electrode and grounding electrode of a semiconductor element to be internally contained is formed on the outer surface of an insulating substrate 1 comprising aluminum nitride made sintered body having a cavity for internally housing the semiconductor element 3 while the electrode 8a of a capacitor element 8 is attached to the connecting pad 5a through the intermediary of a conductive resin made-bonding agent 9, the area of the connecting pad 5a formed on the insulating substrate 1 is specified to be 0.6-200% of the area of the electrode 8a of the capacitor element 8.