| 摘要 |
<p>PURPOSE:To provide a removal method of removing a picture image composed of a resist film disposed on a substrate but being unnecessary in a processing process of a transparent electrodes, semiconductor layers such as amorphous silicon, and insulating layers, etc., upon fabrication of liquid crystal display devices such as a thin film transistor type liquid crystal display device. CONSTITUTION:In a fabrication process of liquid crystal display devices, a curing type pressure sensitive bonding agent or a bonding sheet, etc., are sticked on the upper surface of a picture image composed of a resist film provided on a substrate, and after the bonding agent is cured, the bonding agent or the bonding sheet, etc., and a resist material are exfoliated integrally to hereby remove the resist film picture image on the substrate.</p> |
