MODIFICATION OF SOLDER DEPOSITION COMPOSITION,申请号JP19920321292-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	MODIFICATION OF SOLDER DEPOSITION COMPOSITION
摘要
申请公布号	JPH06152106(A)	申请公布日期	1994.05.31
申请号	JP19920321292	申请日期	1992.11.04
申请人	HARIMA CHEM INC;FURUKAWA ELECTRIC CO LTD:THE	发明人	IRIE HISAO;KUMAMOTO SATOSHI;FUJIWARA TAKAHIRO;FUSE KENICHI;OBARA YUICHI;KOSUGE IZUMI
分类号	B23K35/40;H05K3/24;(IPC1-7):H05K3/24	主分类号	B23K35/40
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Composite reaction member for lateral guidance and levitation control of parellel electrically conductive and ferromagnetic strips

Contactless interrogation of sensors for smart structures

High speed sleever

Methods for fabricating shapes by use of organometallic, ceramic precursor binders

Casing for a telescoped-type munition

Shoulder dressing apparatus

Mowing apparatus

Method and apparatus for ascertaining tool path contours approximating curved contour intersection lines in numerically controlled machines

Pumping system for evacuating reactor chambers

Process for the preparation of glycerophospholipids

Method of optimizing ventilation perfusion match

Preparation of N-substituted 2-pyrrolidones

Heteroaryl substituted phenylethenyl compounds having retinoid-like biological activity

Liquid dispenser

Carboxylic acid leukotriene B4 antagonists

Palm rest for use with computer pointing devices

Chimeric CTLA4 receptor and methods for its use

Asymmetric hydrogenation of furoimidazole derivatives

Chipping hammer