DEVICE FOR THE ELECTROLYTIC TREATMENT OF BOARD-SHAPED OBJECTS

摘要

A device for electrolytic deposition of a metal, preferably copper, onto plate-shaped objects, preferably circuit boards, comprising: an electroplating bath filled with an electrolytic liquid and admitting the objects for a certain period of time. The bath has an electroplating chamber to which the objects are continually fed in a horizontal position and from which they are discharged after an electrolytic treatment. Anodes are positioned in the chamber. Current is applied to the objects, which serve as cathodes. The objects are transported by at least one endless rotating belt and a plurality of transporting clamps positioned on the belt and driven thereby in an endless row one after another. The transporting clamps firmly hold side edges of the objects and move in a transport direction over a transport path which is defined at a beginning and at an end of the chamber. The device is simpler to operate than prior art devices.