PRODUCTION OF WAFER AND DEVICE THEREFOR

摘要

PURPOSE: To provide a method and an apparatus for preparing a wafer wherein the wafer is cut out from an ingot and is recovered through a bore of a cutting blade. CONSTITUTION: When a wafer 25 is cut out from the apex of an advanced ingot 20 by means of a rotating blade 22, a head 27 of a chuck assembly 26 passes through a bore of the blade 22 and faces to the wafer and sucks the wafer 25 by vacuum and the head 27 is turned reversely within a face contg. the central axial line of the ingot 20 and the wafer is discharged on a conveyer 14 at a discharging position on the reverse side in relation to the blade 22. These actions such as cutting, rotating back and forth of the head 27 and suction and discharging of the wafer 25 by the head 27 are repeated.