| 摘要 |
<p>PURPOSE:To improve a mounting density by conducting two or more types of a reflowing process for supplying cream solder, a thermo-compression bonding method for heat seal, a COB process by bonding, an OLB process of a tape carrier package on the same surface. CONSTITUTION:Chip resistors formed of ceramics by plastic molding, an SMD1 (chip) of a chip capacitor, an SMD2 (SOP) packaged with plastic, etc., and a COB 7 for mounting a bare IC are provided on one PWB 12. Among them, the COB 7 is a COB process for mounting a pare IC by bonding 7, and the other placing components are mounted by a reflowing process by supplying cream. In the case of a land surface treatment for connecting the components, an SMD land 5 is executed by electroless Ni-Au plating, and a COB land 8 is conducted by a soft Au plating.</p> |
