| 摘要 |
<p>PURPOSE:To provide a device and method for breaking wafers by which a wafer can be surely split into a plurality of parts. CONSTITUTION:The title device is provided with an optical reader 4 for taking the image of a cut groove 10a, image processor 5 for detecting the rotational angle deviation of a wafer 10 from the image signal of the groove 10a, and driving mechanism 6 which rotationally drives a stage 2 based on the detecting signal of the processor 5. In the title method, in addition, the stage 2 is rotationally moved in accordance with the rotational angle deviation of the wafer 10 after detecting the deviation from the image signal of the groove 10a so that the advancing direction of a roller 3 can become almost parallel to the direction of the groove 10a.</p> |
