| 发明名称 |
Low temperature tin-bismuth electroplating system |
| 摘要 |
A system for electroplating a tin-bismuth alloy at near eutectic composition is disclosed. The system includes the plating bath and the process for initially preparing the bath as well as the process for plating an object with tin-bismuth alloy. The system further includes an apparatus for regulating the concentrations of tin and bismuth in the plating bath and the process by which the concentrations are controlled.
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| 申请公布号 |
US5308464(A) |
申请公布日期 |
1994.05.03 |
| 申请号 |
US19930021397 |
申请日期 |
1993.02.23 |
| 申请人 |
UNISYS CORPORATION |
发明人 |
MURPHY, TIMOTHY I.;REYNOLDS, BRIAN R. |
| 分类号 |
C25D3/60;H05K3/24;H05K3/34;(IPC1-7):C25D17/00 |
主分类号 |
C25D3/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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