| 发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE |
| 摘要 |
<p>PURPOSE:To enhance reliability in connection when a semiconductor chip is mounted on a board. CONSTITUTION:A second dielectric film 7 is laminated on the surface where the lead 6 of first dielectric film 5 is formed such that only inner lead 6a is exposed and then the inner lead 6a is bonded to a bump electrode 4 formed on the electrode pad 3 of a semiconductor chip 2. A solder bump 9 is formed in an opening 8 made in the rear of the first dielectric film 5 and the semiconductor chip 2 is mounted on a board 1 through the solder bump 9.</p> |
| 申请公布号 |
JPH06120296(A) |
申请公布日期 |
1994.04.28 |
| 申请号 |
JP19920268290 |
申请日期 |
1992.10.07 |
| 申请人 |
HITACHI LTD;HITACHI HOKKAI SEMICONDUCTOR LTD |
发明人 |
FUJISAWA ATSUSHI |
| 分类号 |
H01L21/60;H01L23/12;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
