| 摘要 |
PURPOSE:To provide a semiconductor mold die, in which resin is uniformly injected into all cavities so that the improvements of moldability of a package and of yield can be contrived. CONSTITUTION:In the structure of this die, the diametral dimension of the tip of a first ejector pin 16 is larger than the section width of a subrunner 13 and the first ejector pin 16 and second ejector pin 21 operate independently. In the injection of resin, the first ejector pin 16 is first caused to go up so that respective subrunners 13 are intercepted from a runner 14 and the resin is supplied only to the runner 14. After that, the first ejector pin 16 is caused to go down so that the paths of the subrunners 13 are secured, and the resin is simultaneously injected into respective cavities 15. |
