发明名称 AUTOMATIC WIRE BONDER
摘要 PURPOSE:To provide an automatic wire bonder by which an irregularity in a ball diameter is small when a ball is formed by making an electric discharge from a discharging electrode more stable. CONSTITUTION:A discharging electrode 1a and its head part 1b are molded by using a Pt alloy which contains Pt at a purity of 99.9% or one kind or two or more kinds out of 1 to 35wt.% of Ir, 1 to 30wt.% of Pd, 1 to 20wt.% of Au, 1 to 25wt.% of Ni, 1 to 10wt.% of W and 1 to 15wt.% of Ru and which is composed of 65wt.% of Pt as the remainder, and an automatic wire bonder 1 is manufactured.
申请公布号 JPH06112263(A) 申请公布日期 1994.04.22
申请号 JP19920262222 申请日期 1992.09.30
申请人 TANAKA DENSHI KOGYO KK 发明人 ITABASHI KAZUMITSU
分类号 H01L21/60 主分类号 H01L21/60
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