发明名称 PLASMA PROCESSING APPARATUS AND ITS HANDLING METHOD
摘要 <p>PURPOSE:To control temperature with high precision and uniformity by providing a through hole in the depth direction and a groove for distributing a gas for heat conduction in an electrostatic chuck which holds a sample substrate on a table. CONSTITUTION:An electrostatic chuck 5 of an apparatus A for plasma processing of a sample substrate 3 in a vacuum chamber 6, comprises a conductor 1 and a dielectric 2 containing the conductor therein. Static electricity generated in the dielectric 2 when the conductor is impressed with a voltage, is utilized to hold a sample substrate 3 on a mount table 4 in a manner of freely attaching or removing it. The center of the electrostatic chuck 5 is arranged in a similar figure as the sample substrate 3, and an appropriate number of through holes 8, outermost periphery of which is 5 to 10mm less than the periphery of the electrostatic chuck 5, are formed in the depth direction. Further, a groove 7 distributing a gas for heat conduction is formed at a joint with the electrostatic chuck 5 of the mount table 4. Temperature control of the sample substrate 3 can be performed with high precision and g processing with good energy efficiency can be performed.</p>
申请公布号 JPH06112302(A) 申请公布日期 1994.04.22
申请号 JP19920256272 申请日期 1992.09.25
申请人 KOBE STEEL LTD 发明人 NOZAWA TOSHIHISA;KINOSHITA TAKASHI;NISHIZUKA TETSUYA
分类号 B01J19/08;C23F4/00;H01L21/302;H01L21/3065;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 B01J19/08
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