| 摘要 |
PURPOSE:To facilitate manufacturing and to enhance the dimension accuracy of a bridge conductive pattern since the bridge between patterns can be manufactured in the manufacturing process of a substrate by repeating known processes of coating of a resist, exposure, and the dissolution and plating of the resist. CONSTITUTION:A conductive pattern 3 of bridge connecting conductive patterns 2a, 2b, 2c, and 3d can be formed by repeating coating and plating processes of a resist, thus manufacturing the bridge 3 for connecting the conductive patterns 2a, 2b, 2c, and 2d on formation of the substrate. |
