FILM CARRIER, SEMICONDUCTOR DEVICE UTILIZING THE SAME AND MOUNTING OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide a film carrier, a semiconductor device and a mounting constitution of the semiconductor device which can prevent inflow of solder into a semiconductor device mounting region during connection of film carrier mounting a semiconductor device on an external substrate. CONSTITUTION:An insulating wall 3 which is poor in wettability for solder 8 is formed between the loading part of a semiconductor element 5 and connecting part with circuit wiring 7 on an external substrate 6 at the surface of a lead 1 on a film carrier. As the desirable material for insulating wall3, a resin such as polyimide is used and it is processed by a means such as the dry etching method.