| 摘要 |
PURPOSE:To obtain a wire bonding inspector which accurately recognizes the center of a bonding part and performs processing speedily. CONSTITUTION:The image of an object 1 to be inspected which is wire-bonded is picked up by an image pick-up device 3, the projection pattern of an image which is stored by an image memory 5 as a digital image signal is created by selecting a 0 deg. cutting projection circuit 11 or 45 deg. cutting projection circuit 12 according to an inspection window cutting direction which is stored in a wire direction memory 13, a center is obtained by a ball center calculation circuit 14, and conformity is judged by a criterion circuit 15. Operation regarding projection is simplified and executed by hardwares easily, and an inspection can be performed speedily. |
