发明名称 Verfahren und Einrichtung zur Herstellung von elektronischen Bausteinen
摘要 1,042,799. Making printed circuit assemblies. GRETAG A.G. Dec. 4, 1964 [Dec. 5, 1963], No. 49549/64. Headings B3A and B3R. In a method of assembling wire-ended electrical components into a module a pair of notched locating racks 11 is positioned in stacking rails 20a, 20b and 21a, 21b and slide members 16, 17 of a jig are positioned with index marks 19a, 19b aligned with marks 18a, 18b respectively. A first tier of components is inserted in opposed notches in the racks, a further pair of racks is positioned in the stacking rails and a second tier of components inserted in the notches. The racks are slightly spaced apart by pins 22 (Figs. 7, 8, not shown) and when the final tier of components is in place, a final locating rack may be put on the top tier in each stack. A backing up plate 28 is fitted on to a carrier 25 and advanced until in contact with the projecting wire ends of the components. Slide 17 is traversed almost up to the plate 28, carrier 25 is retracted and the plate 28 replaced by a printed circuit. The carrier is advanced again until the slide 17 is in its former position, the wires passing through holes in the printed circuit. The operation is repeated at the other end of the assembly, the pins 22 are removed, the assembly removed from the jig and dipped in solder. There is a heater in the floor of the solder bath and the oxide film is removed with a knife blade before dipping.
申请公布号 DE1237189(B) 申请公布日期 1967.03.23
申请号 DE1964G042105 申请日期 1964.11.25
申请人 GRETAG AKTIENGESELLSCHAFT 发明人 EHRAT DIPL.-ING. KURT;ECKSTEIN ELEKTR.-ING. DIETER
分类号 H05K1/14;H05K13/00 主分类号 H05K1/14
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