| 摘要 |
<p>PURPOSE:To acquire a highly reliable semiconductor device by using thermoplastic resin for relaxing thermal stress during die bonding and by preventing generation of out gas during curing. CONSTITUTION:A chip 2 is temporarily attached onto an island 1 by thermoplastic resin 3. Thereafter, a coating layer by thermosetting resin 5 is formed ranging over a side surface of the chip and a main surface of the island part by a method such as dipping to prevent out gas from being generated by thermoplastic resin during curing.</p> |
