| 摘要 |
The purpose of the present invention is to provide a miniature housing for semiconductor components and/or passive electronic components which can be introduced into thin flexible printed circuit boards, in which the electronic components can be contacted via microwire and which can withstand the pressures and temperatures arising in plastic board lamination or injection moulding. According to the invention, this purpose is attained in that the upper side of a plastic housing frame (9) has a shape rising from the inside to the outside in three stages, the innermost stage comprising through holes, the underside of the housing frame being connected to a metal conductor frame (1) and in that there are through holes (8) in the housing frame (9) at those points beneath which are located the contact surfaces of the conductor frame terminals which taper in the lower region. The invention relates to a miniature housing for electronic components, preferably for the protected arrangement of electronic components like semiconductor chips and the like. |
