| 摘要 |
PURPOSE:To prevent troubles when a lead is molded by preventing the formation of the residue of a dam resin when the dam resin part of an IC package after resin molding is punched out with a punch. CONSTITUTION:A sealing metal mold for a resin molded IC has a punch 5 and a lower die 1. A metal-mold recess part 3 is provided in the lower die 1. A resin, which is filled in this package part 2, is further filled in the metal- mold recess part 3 and then filled into a tie-bar part 7. As a result, the molded product has the dam resin part having a protruding part. Stress is concentrated on the surrounding part of the resin in protruding shape when the dam resin is punched out, and the resin can be completely punched out. |
