| 摘要 |
PURPOSE:To obtain a sharable fixing jig in which an inner lead wire and a die pad are on the same flat surface in wire bonding process by using a shape memory alloy as a material for a lead frame used for a semiconductor device to be made through sealing with resin. CONSTITUTION:By using a shape memory alloy for a lead frame, a die pad 42 required for preventing short circuit between a corner of a semiconductor element 32 and a metal wire 34 can be provided under an inner lead 3 for supporting it, and interchanging of jigs at the time of wire bonding for supporting the die pad 42 under the inner lead wire 3 is eliminated. In other words, by heating the die pad 42, with the use of a heating jig, to more than a threshold value at which shape change begins to occur, a tab suspending lead wire is recovered to the previously stored shape. As a result, the die pad 42 can be provided under the inner lead wire 3. |
