| 摘要 |
PURPOSE:To mount bumps to specified height on a circuit board with high reliability without having crumbling, sagging, etc. CONSTITUTION:Bumps 24 formed on electrodes 13 for bumps are exposed only at their tip parts 25, and the remaining parts 23 are surrounded by a resist layer 26 at their peripheral parts. A method of forming bumps on an IC semiconductor device is the following. Barrier metals are formed at electrode parts for bumps of a wiring layer, and resist of specified thickness is formed at parts other than the electrodes for bumps, and bumps are formed on the barrier metals leaving the resist unremoved at the parts other than the electrodes for bumps. This bump structure suppresses the generation of deformations such as crumbling and sagging of the bumps, solder flowing over the bumps, etc. Accordingly, this structure is optimum for flip chip mounting of IC semiconductor devices on a circuit board. |
