| 摘要 |
<p>A pull-raising member (2A) and pull-raising unit (2) for peeling a thin (1D) film from a base plate such as a printed circuit board or the like having an improved average throughout rate. The pull-raising member (2A) includes a plurality of pull-raising blades (2Aa; 2Ab) disposed substantially parallel to an end of the thin film (1D). In the pull-raising unit (2) in which the pull-raising member (2A) is employed, an elastic member (2C), which is employed to bring the pull-raising blades (2Aa; 2Ab) of the pull-raising member (2A) into contact with the base plate, is interposed between the pull-raising member (2A) and an attaching member (2D) to slide the pull-raising member (2A) in such directions as to move into and out of contact with the base plate.</p> |
