| 摘要 |
<p>PURPOSE:To detect deviation information without contact and to prevent damage of a pad by sensing the information of a contact pad of a chip from a probe needle in directions X, Y by an optical element by utilizing a reflected light of a marker provided on an LSI chip. CONSTITUTION:When a contact pad of an LSI chip is aligned with a probe needle 11 in a test of the chip on a semiconductor wafer 12, with a midpoint of two markers 13 (13a, 13b) provided on the chip as a center of coordinates the coordinates of a photoreceiver 8 (8a, 8b) at a probe side are set. Then, the wafer is radially irradiated with a light for the probe of the markers 13 from a light emitting element 8. The coordinates of the markers 13 are calculated by a position detector 3 from the coordinates of the element 8 and the reflected light. Then, the coordinates of the midpoint of the markers 13 are calculated from the coordinates of the markers 13 by a controller 6, and a chuck 7 is so moved through a chuck driving unit 5 in directions X, Y that the coordinates become (0, 0).</p> |
