Leiterplatten mit niedriger Dielektrizitätskonstante.

摘要

The invention features a printed circuit board and a method of fabricating a printed circuit board with low dielectric materials using a modular technique. Sub-assemblies (10) are first constructed, tested, and then subsequently incorporated into the final circuit board assembly (20) which has a triplate geometry. Dielectric materials are chosen which enhance the performance of the circuit board.