发明名称 THIN-FILM LAMINATED DEVICE
摘要 <p>PURPOSE:To obtain the thin film laminated device which is light in weight and low in cost, is free from peeling and cracking of films, curling of substrates, etc., and has good reliability by maintaining the total stress of buffer layers within a prescribed range. CONSTITUTION:A transparent electrode material for pixel electrodes is deposited on a plastic substrate 1 coated 2a, 2b with inorg. thin films consisting of inorg. materials, such as SiO2 or Si3N4, and having the stress range from total stress-700Pa. m (compressive stress) to +700Pa.m (tensile stress) as the buffer layers and is patterned to prescribed patterns, by which the pixel electrodes are formed. A conductor thin film for lower electrodes is then formed and is patterned to prescribed patterns to form conductors 7 to constitute the lower electrodes. A hard carbon film 2 is applied thereon and is patterned to prescribed patterns to form insulating films, on which a conductor film for bus lines is applied and is patterned to prescribed patterns to form conductors 6 to constitute bus lines. Finally, the unnecessary part of the lower electrodes are removed to expose the transparent electrode patterns, by which the pixel electrodes are formed.</p>
申请公布号 JPH05313210(A) 申请公布日期 1993.11.26
申请号 JP19920148124 申请日期 1992.05.14
申请人 RICOH CO LTD 发明人 YAMADA KATSUYUKI
分类号 G02F1/133;C23C14/06;C23C14/10;C23C16/26;G02F1/1333;G02F1/136;G02F1/1365;H01L23/14;H01L27/01;H01L49/02;(IPC1-7):G02F1/136 主分类号 G02F1/133
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