发明名称 Multiple bus architecture for flexible communication among processor modules and memory subsystems and specialized subsystems
摘要 A multiple bus architecture for flexible communication between processors, memory subsystems, and specialized subsystems over multiple high performance communication pathways. The multiple bus architecture enables flexible communication between processors and devices coupled to a multiprocessor bus, a system interconnect bus, an external bus, an input/output bus, and a memory subsystem. Processor modules coupled to multiprocessor bus slots access the memory subsystem over the multiprocessor bus. System interconnect modules coupled to system interconnect bus slots access the memory subsystem via the system interconnect bus, and the multiprocessor bus. Processor modules coupled to multiprocessor bus slots access devices on the external bus via the system interconnect bus.
申请公布号 US5263139(A) 申请公布日期 1993.11.16
申请号 US19920886045 申请日期 1992.05.19
申请人 SUN MICROSYSTEMS, INC. 发明人 TESTA, JAMES;BECHTOLSHEIM, ANDREAS;FRANK, EDWARD
分类号 G06F13/36;G06F13/14;G06F13/38;G06F13/40;(IPC1-7):G06F13/14;G06F13/16;G06F13/20 主分类号 G06F13/36
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