| 摘要 |
<p>PURPOSE:To make an inspection mark on a surface of a semiconductor chip without mechanically causing a flaw or causing a flaw by a laser beam. CONSTITUTION:Test pads 12 and 13 are provided in addition to a plurality of bonding pads 11. The test pads 12 and 13 are connected by wiring a polysilicon resistance wire 16 along through holes 14 and 15. A probe of a tester is put in contact with the bonding pads 11 and the test pads 12 and 13 for an acceptance check of a semiconductor chip. When the semiconductor chip is judged to be defective, a given current is applied across the test pads 12 and 13 so that the polysilicon resistance wire 16 is discolored by heat due to the applied current.</p> |
