| 摘要 |
PURPOSE:To make it possible to reduce the thickness of a plastic sealed semiconductor device to a much greater extent. CONSTITUTION:A through-aperture 8A that is slightly wider than a semiconductor element 1 is formed on a die pad frame 8. The element 1 is housed in this aperture 8A, and a gap between a side surface of this element 1 and a side surface of the aperture 8A of the frame 8 is filled with an insulating adhesive 9, thereby fixedly adhering the element 1 to the frame 8. In addition, a number of leads 5 are fixed to this frame 8 with an insulating tape 10. |
