SEMICONDUCTOR DEVICE AND ITS PACKAGING METHOD

摘要

PURPOSE:To increase reliability of a flip-chip semiconductor device by enhancing airtightness and at the same time package a printed wiring board without forming a bump electrode. CONSTITUTION:Parts other than an aluminum pad 4 of a semiconductor element 2 where a circuit pattern area 3 is provided at a surface side and the aluminum pad 4 for leading is formed are sealed by a mold resin 5. Also, a solder 11 is supplied to an electrode pad 10 of a printed wiring board 9 and the aluminum pad 4 at the surface side of a semiconductor device 1 where the parts other than the aluminum pad 4 are sealed by resin is connected to the electrode pad 10.