| 摘要 |
PURPOSE:To provide a bare chip soldering method by which a bare chip is soldered in such a way that a heat spreader to which the bare chip is soldered in advance is put on a hot plate and the solder part is again melted by heating the solder part by means of the hot plate while the hot plate is vibrated. CONSTITUTION:A bare chip 4, etc., is soldered to a heat spreader 3 in a reflow process and the heat spreader with the soldered bare chip 4 is taken out from jigs A and B in a taking-out process, and then, the heat spreader is subjected to visual and X-ray inspections in an inspection process. When the heat spreader with the soldered bare chip is accepted as a result of the inspection process, the heat spreader is put on a hot plate 1 fitted with an ultrasonic vibrator 2 and the solder part 5 is again melted while the plate 1 is finely vibrated so as to remove bubbles 6 in a bubble removing process. Then the spreader is mounted on a base substrate which has been subjected to a cream solder printing process and soldered to the base substrate by reflow processing. |
