| 摘要 |
<p>PURPOSE:To eliminate the need for integrating an insulation material or an insulation sheet and to achieve miniaturization and a low cost by laying out a coil opposite to a magnetic sensor so that they sandwich a substrate for securing insulation. CONSTITUTION:Chip coils 2 and 3 are laid out on the main surface of an alumina substrate 1 and the upper part is interlocked by a ferrite core 4 for constituting a magnetic circuit. Also, a ferromagnetic thin-film magnet resistance element (MR element) 16 is provided at the other surface side of the substrate 1 so that it opposes the coils 2 and 3. Namely, an appropriate gap is provided between the coils 2 and 3 and the MR element 16 and at the same time the coils 2 and 3 and the element 16 are insulated by the substrate 1. Then, leakage flux from the coils 2 and 3 for the thickness gap of the substrate 1 is detected by the element 16. Electrically, an adequate withstand voltage is obtained by the substrate 1 and, furthermore, the gap between the coils 2 and 3 is reduced, thus reducing the occupied area of the substrate 1.</p> |
