| 摘要 |
PURPOSE:To prevent the generation of the excessive flow of a resin while eliminating the turbulent flow thereof by controlling the pressure and flow velocity of the head resin in a mold at the time of the resin sealing of a semiconductor device. CONSTITUTION:Rotary shafts 3, 4 are respectively connected to the upper and lower molds 1, 2 separated up and down of a resin sealing device and, after mold clamping, a resin is supplied and the molds are rotated to inject the resin in a cavity part 5 formed by both molds. |
