| 摘要 |
PURPOSE:To prevent lead warpage caused by the contraction of the resin tape of a resin-sealed semiconductor device 1 which has COT structure. CONSTITUTION:For a resin-sealed semiconductor device 1 which has COT structure, notched parts are provided in the areas which are in the outer circumference of at least two facing corners or sides of a semiconductor pellet 2 in the peripheral area of resin tape 4. |
