发明名称 |
Selective process for printing circuit board manufacturing |
摘要 |
A new family of palladium based metallization catalyst compositions is disclosed. These catalysts are used in a process for the selective deposition of a metal on a substrate when a metallization mask (i.e. a plating resist) is used over the substrate. Processes and compositions are also disclosed for manufacturing printed circuit boards, by using two metallization sequences, or one alone the latter comprising a so-called "selective process." The process and composition are generally employed for the electroless plating of substrates, namely the metallization of plastics, ceramics, anodized aluminum and other materials.
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申请公布号 |
US5250105(A) |
申请公布日期 |
1993.10.05 |
申请号 |
US19910653342 |
申请日期 |
1991.02.08 |
申请人 |
EID-EMPRESA DE INVESTIGACAO E DESENVOLVIMENTO DE ELECTRONICA S.A. |
发明人 |
GOMES, JOSE M. G.;RODRIGUES, ANA P. T. L. |
分类号 |
C23C18/28;C23C18/30;C23C18/31;C23C18/34;C25D7/00;H05K3/18;H05K3/42;(IPC1-7):B05D3/10;B01J23/58 |
主分类号 |
C23C18/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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