| 摘要 |
PURPOSE:To obtain a semiconductor integrated circuit manufacturing mask which is capable of forming either of an inverted circuit pattern or a non- inverted circuit pattern on a wafer by turning a piece of mask upside down. CONSTITUTION:For the formation of semiconductor chips on a wafer, a semiconductor chip circuit pattern 3a and aligning marks 4a and 9a required for alignment carried out between wafer manufacturing processes are formed on glass substrates where a light shading thin film is applied to serve as masks, where aligning marks formed by laterally inverting the aligning marks 4a and 9a like mirror images are arranged on the masks besides a circuit, pattern and aligning marks. Letters used for recognizing that a mask is laid making its front side face upward or downward and other letters used for recognizing that a circuit pattern inside a semiconductor chip is inverted or non-inverted are arranged on the mask. Furthermore, another glass substrate is bonded to the surface of the glass substrate where a light, shading thin film has been applied. |
