HOT MELT ADHESIVE COMPOSITIONS

摘要

This is a new hot-melt adhesive composition which maintains adhesive strength at high temp, and has advanced workability and adhesion durability. The a adhesive composition comprises 15-45 wt.% ethylene vinyl acetate copolymer; 0.5-10 wt.% modified epoxy resin; 0.05-5 wt.% phthalic acid ester; 15-45 wt.% tackifier; 15-45 wt.% inorganic filler; and 0.05-5 wt.% heat stabilizer. Pref. the composition is prepared by adding and mixing 0.5-10wt.% modified epoxy and 0.05-5 wt.% phthalic acid ester in the ethylene vinyl acetate copolymer with inorganic filler. The above epoxy is bisphenol A type epoxy resin.