发明名称 MULTILAYER PRINTED CIRCUIT BOARD
摘要 <p>PURPOSE:To provide a multilayer printed circuit board which can avoid signal leakage and influence of external electric wave and at the same time reduce device cost and miniaturize the device in a multilayer printed circuit board which is used for a microwave communication device etc. CONSTITUTION:A high-frequency signal which is input to and output from connectors 1 and 2 and amplifier circuits 7a and 7b is transmitted through a signal transmission line layer 5 provided inside a multilayer printed circuit board 3. An internal ground layer 9 and a ground layer 11 are provided on the upper and lower sides of the signal transmission layer 5 through an insulation material 13.</p>
申请公布号 JPH05243782(A) 申请公布日期 1993.09.21
申请号 JP19920043954 申请日期 1992.02.28
申请人 NEC CORP 发明人 WATANABE HIDEO
分类号 H05K3/46;H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K3/46
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