CURING OVEN FOR SEALING SEMI-CONDUCTOR CHIP

摘要

PURPOSE:To heat close to the reference temperature suitable for curing and prevent completely the generation of liquid sagging, crack and the like when a coated carrier tape provided with semi-conductor chips and coating said chips with resin for sealing is driven in an oven and the resin is heat cured. CONSTITUTION:A batten-shaped temperature measuring auxiliary piece 9 is installed at an end of a thermocouple 8a for heat controlling positioned and disposed between a carrier tape 6 and a far infrared ray panel heater 5b in a manner of its longitudinal direction in the transfer direction of the carrier tape 6 and its width direction in the width direction of the carrier tape 6.