发明名称 Apparatus for shaping solid profile resin bodies
摘要 An apparatus for shaping a solid profile of a resin body by which time required for shaping of a resin body can be reduced and the quality of a product can be improved. A work is first dipped into solution of a photo-setting resin accommodated in a resin vessel to a depth equal to a thickness with which a resin layer is to be formed on an upper face of the work. A dam member in the resin vessel defines a liquid level of the resin solution. Then, an elongated nozzle member is laterally horizontally moved along the upper face of the work while supplying resin solution to the upper face of the work to apply the resin solution by a desired thickness to the upper face of the work. Resin liquid spilled over from the dam member upon such movement of the nozzle member is accommodated once into an auxiliary resin solution accommodating section and then supplied to the nozzle member. Finally, light is irradiated upon the resin solution on the upper face of the work to harden the resin on the work to form a solidified resin layer on the work.
申请公布号 US5238497(A) 申请公布日期 1993.08.24
申请号 US19910770331 申请日期 1991.10.03
申请人 SONY CORPORATION 发明人 SEGAWA, TAKASHI
分类号 B29C35/08;B29C67/00;B29K105/24 主分类号 B29C35/08
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