发明名称 HYBRID INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To connect an external terminal to a wiring without requiring a facility and a jig by placing leads on a board and composing of a chiplike terminal component. CONSTITUTION:First, a chiplike terminal component 6 is placed on a board 1 by the same device in the same step as that of an electronic component 2, and connected to a wiring 5 on the board 1 by a connecting material 3. Thereafter, it is exposed without covering a part to become an external terminal of the component 6, and a sheath 4 is provided. Since a surface to be connected to the wiring 5 of the component 6 must be electrically conducted with a component to become the external terminal, the entire component 6 is formed of a conductor or electrically short-circuited by a conductor film. Thus, in order to provide the external terminal, the component 6 is used thereby to place by the same step and device as those of a general electronic component, and a surface mounting type hybrid integrated circuit can be easily inexpensively realized.
申请公布号 JPH05211280(A) 申请公布日期 1993.08.20
申请号 JP19910304303 申请日期 1991.11.20
申请人 NEC CORP 发明人 HOSOYA FUTOSHI
分类号 H01L23/12;H01L23/28;H01L23/32;H01L23/50;H01L25/00;H01L25/04;H01L25/18;H05K3/28;H05K3/34;H05K3/36;H05K3/40 主分类号 H01L23/12
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