| 摘要 |
PURPOSE:To reduce the resin thickness of a package by tilting vertically projection to a bonding surface from a ball bonding section. CONSTITUTION:A projecting direction of a wire 1 has specific tilting vertically to a bonding surface of a bonding pad 7 of a semiconductor chip 4 which is die bonded with a tab 5 of a lead frame. In other words, the projecting direction of the wire 1 which projects from a ball bonding section 2 forms tilting to the vertical direction. At the same time, the first bonding is carried out on the ball bonding section 2 in a condition as closer as possible to the surface of the semiconductor chip 4. As the second bonding, a wedge bonding section 3 is formed on an inner lead 6. As a result, loop height of the wire 1 can be reduced lower than conventional height, thereby reduction of package thickness can be realized and flow of wire can be prevented. |
